Vendor: Honeywell

900P01-0301 | Honeywell | 120/240VAC Power Supply Module

SKU: 900P01-0301
In stock
Description

Honeywell 900P01-0301 Power Supply Module

Configured for regulated AC‑to‑DC conversion in HC900 control assemblies, the Honeywell 900P01‑0301 (900P01‑0301 power supply) provides direct electrical execution of input conditioning, inrush handling, and stable DC output delivery for controller and I/O backplane loads.

Hardware Specifications

Parameter Specification
Model 900P01‑0301
Brand Honeywell
Origin USA
Weight 0.82 kg (shipping weight 2 kg)
Dimensions 137 mm H × 72.6 mm W (5.4 in × 2.86 in)
Operating Temp Not specified
Power Consumption Not specified
Input Voltage 90–264 VAC, 47–63 Hz
Input Current 1.4 A max continuous
Inrush Current 40 A peak‑to‑peak for 120 ms @ 240 VAC
Input Rating 130 VA
Output Rating 58 W
Hold‑Up Time 20 ms @ 115 VAC, 60 Hz, maximum load
Fuse Internal non‑replaceable
Wiring Screw terminals, 0.3 mm²–3.3 mm² (12–22 AWG)
Test Jacks 5 VDC, 24 VDC

4-20 mA Loop Stability and Channel Isolation

Within Honeywell process‑control environments, the module’s regulated DC output maintains stable supply conditions for downstream analog modules carrying 4–20 mA loops. Channel‑to‑channel isolation in adjacent I/O assemblies is preserved when proper grounding and wiring separation are maintained. Cold junction compensation (CJC) circuits in temperature modules remain unaffected due to the supply’s controlled ripple and thermal profile.

Frequently Asked Questions

Q: Can the 900P01‑0301 be inserted or removed while the chassis is energized? A: Hot‑swap is not supported. The chassis must be de‑energized to avoid backplane disturbance.

Q: Does the inrush current require upstream breaker coordination? A: Yes. The 40 A peak inrush may require coordination to prevent nuisance tripping during startup.

Q: Are firmware updates relevant to this module? A: No. The unit contains no user‑upgradeable firmware; compatibility is electrical only.

Field Installation Guidelines

  • Maintain correct torque on screw terminals to prevent micro‑movement under vibration.
  • Route AC input wiring separately from low‑voltage DC output conductors to reduce coupling.
  • Bond shield grounds at a single point to avoid circulating currents.
  • Ensure adequate airflow around the module to prevent thermal buildup.
  • Use test jacks only for measurement, not for powering external loads.