Vendor: Honeywell

Honeywell 51402199-100 Enclosure w/ Circuit Boards

SKU: 51402199-100
In stock
Description

Honeywell 51402199-100 Enclosure Circuit Boards

The Honeywell 51402199-100, also cataloged as the 51402199-100 enclosure assembly, operates as a dedicated hardware housing for multiple circuit boards within Honeywell Distributed Control Systems (DCS).

Hardware Specifications

Parameter Specification
Model 51402199-100
Brand Honeywell
Origin Honeywell DCS
Weight 10 lbs (approx. 4.5 kg) full enclosure; ~1.2 kg internal boards
Dimensions 7" H × 17" W × 20" L (internal board profile 36.6 cm × 36.3 cm × 1.5 cm)
Operating Temp -40 deg C to +70 deg C (-40 deg F to +158 deg F)
Power Consumption 24 VDC nominal input
Integrated Circuit Boards Supports up to 5 peripheral/control cards
Pre-configured Modules 51401052-100 Smart Peripheral Board, 51196653-100 Control Module Board, 51400646-100 Dual Fan Board
Humidity Range 5% to 95% RH non-condensing
System Integration Interfaces with Honeywell legacy DCS buses
Application Centralized rack sensor integration and ruggedized housing

4-20 mA HART Loop Protocol

The enclosure and its circuit boards are designed to support 4-20 mA HART loop protocol devices, enabling analog signal transmission with embedded digital diagnostics. Channel-to-channel isolation is maintained across peripheral boards, ensuring deterministic communication and minimizing interference within Honeywell DCS environments.

Frequently Asked Questions

Q: Can the enclosure be populated with mixed board types? A: Yes, it supports up to 5 slots and can host different Honeywell peripheral/control boards simultaneously.

Q: Is hot-swap insertion supported for the circuit boards? A: No, boards must be installed or removed during controlled shutdown to maintain backplane stability.

Q: How is redundancy achieved in fan modules? A: The dual fan circuit board provides parallel fan operation; failure detection is handled at the subsystem level.

Field Installation Guidelines

  • Mount enclosure on stable rack structures; ensure vibration isolation.
  • Maintain grounding continuity for shielding layers to reduce EMI.
  • Route coaxial and analog wiring separately from high-voltage conductors.
  • Observe humidity limits; avoid condensation inside enclosure.
  • Verify environmental conditions remain within -40 deg C to +70 deg C during operation.
  • Secure all board slots and connectors to prevent mechanical loosening under thermal cycling.